Waveguide and semiconductor packaging

摘要

A method and apparatus for integrating individual III-V MMICs into a micromachined waveguide package is disclosed. MMICs are screened prior to integration, allowing only known-good die to be integrated, leading to increased yield. The method and apparatus are used to implement a micro-integrated Focal Plane Array (mFPA) technology used for sub millimeter wave (SMMW) cameras, although many other applications are possible. MMICs of different technologies may be integrated into the same micromachined package thus achieving the same level of technology integration as in multi-wafer WLP integration.

主权项

1. A pixel for a sub-millimeter wavelength (SMMW) imaging system using a focal plane array (FPA) , each pixel of said FPA comprising:
a chip interface layer comprising one or more DC through vias, and one or more solder balls on the upper surface of the chip interface that are coupled with the one or more DC through vias; a waveguide layer comprising one or more rectangular waveguide cavities said waveguide layer having a lower surface operatively connected to the upper surface of the chip interface layer such that the rectangular waveguide cavities are aligned with the solder balls; one or more monolithic microwave integrated circuit (MMIC) chips attached to the one or more solder balls on the chip interface layer and electromagnetically coupled to the one or more rectangular waveguide cavities in the waveguide layer; and an antenna layer operatively coupled to an upper surface of the waveguide layer such that an antenna is aligned with at least one of the rectangular waveguide cavities; wherein SMMW signals are received through the antenna, transmitted through the rectangular waveguide cavities and processed by the MMIC chips.