| 摘要 |
PURPOSE:To provide a surface treating method for inner layer core material of a multilayer printed wiring board in which haloing is prevented from occurring on a surface subjected to blackening. CONSTITUTION:Copper foil surface of a core material 6, on which an inner layer circuit is formed, is subjected to blackening to form a copper oxide film 8, the surface of which is then subjected to reduction treatment with hydrogen gas produced when an amphoteric metal 10 is dissolved into alkaline solution 4. |
