COMPOSITE FINE PARTICLES, DISPERSION LIQUID, PRODUCTION METHOD AND USE OF SAID COMPOSITE FINE PARTICLES, AND PRODUCTION METHOD AND USE OF SAID DISPERSION LIQUID

摘要

Each of composite fine particles of the present invention is prepared by covering at least a part of the surface of a metal fine particle with a protective layer that contains an acid-decomposable polymer. The thus-obtained composite fine particles are able to be sintered at low temperatures. The composite fine particles may have an average particle diameter of 3,000 nm or less. The metal fine particle may be a copper fine particle. The acid-decomposable polymer may have an acetal bond. A wiring board may be produced by: preparing a conductive ink or conductive paste by adding an acidic compound and/or an acid generator into a dispersion of the composite fine particles; and firing the conductive ink or conductive paste at 200°C or less.