Heat dissipation for substrate assemblies

摘要

Various embodiments described herein include systems, methods and/or devices used to dissipate heat generated by electronic components in an electronic system (e.g., a memory system that includes closely spaced memory modules). In one aspect, an electronic system includes a substrate, at least one electronic component, and a heat sink. The at least one electronic component is mechanically coupled to the substrate and thermally coupled to a ground plane of the substrate, such that heat generated by the at least one electronic component is dissipated at least partially to the ground plane of the substrate. The heat sink is mechanically coupled to an edge of the substrate, and thermally coupled to the ground plane of the substrate to at least partially dissipate the heat generated by the at least one electronic component. In some embodiments, the heat sink further includes an attachment structure, a tab and a plurality of heat dissipaters.

主权项

1. An electronic system, comprising:
a substrate comprising a ground plane; at least one electronic component mechanically coupled to the substrate and thermally coupled to the ground plane, such that heat generated by the at least one electronic component is dissipated at least partially to the ground plane of the substrate; and a heat sink mechanically coupled to an edge of the substrate, the heat sink being thermally coupled to the ground plane of the substrate to at least partially dissipate the heat generated by the at least one electronic component, wherein the heat sink further comprises a slot configured to receive the edge of the substrate; and a tab located opposite to the slot configured to slide into a card guide slot.