发明名称 RESIN SEALED ELECTRONIC DEVICE
摘要 PURPOSE:To obtain highly reliable resin sealed devices, by performing oxidation treatment of polyphenylene sulfide, washing the material with hot water, and decreasing the amount of inclusion of water-soluble electrolytic component. CONSTITUTION:An inorganic filler such as dissolved silica is compounded in polyphenylene sulfide PPS. Silane and Ti coupling agents are compounded as required, and the adhesion of the resin and the part is increased. At first the PPS is immersed in a water solution of hydrochloric acid and acetic acid. Then, remaining acid and salt are removed by several times of washings using water or hot water. Thereafter, the material is treated by the hot water at 170 deg.C or higher, and the water-soluble electrolytic component, which is present in a form of acid or salt, is physically removed. The chemical denaturation of the end of polymer, which has the electrolytic component that can undergo hydrolysis is efficiently performed. The electric conductivity of the washing water is made to be 5muS/cm. The bath ratio of 200gr of the PPS with respect to 1l of water is specified. The granule is washed in an O2 atmosphere several times. When the resin sealing is performed by the PPS having this constitution, highly reliable devices having especially good moisture resistance are obtained.
申请公布号 JPS61220446(A) 申请公布日期 1986.09.30
申请号 JP19850060818 申请日期 1985.03.27
申请人 TORAY IND INC 发明人 KOBAYASHI HIROKAZU;KISHIMOTO AKIHIKO
分类号 C08G75/02;C08G75/06;C08L81/02;H01L23/29;H01L23/31 主分类号 C08G75/02
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