| 摘要 |
PROBLEM TO BE SOLVED: To obtain a method and an apparatus for evaluating the solder shape at the time of BGA(bal grid array) mounting in which defective solder shape after secondary mounting of BGA is evaluated before secondary mounting, and a computer readable recording medium storing a program for evaluating the solder shape at the time of BGA. SOLUTION: The method for evaluating the solder shape at the time of BGA comprises a step of determining the total solder volume V of solder balls 6 and solder for bonding them, a step for operating the shape of a spherical liquid drop based on the solder volume V and the radius (b) of a land 17, a step of determination a same diametral position on the shape of the spherical liquid drop where the diametral dimension traversing the spherical liquid drop is equal to the diameter TD of a tape opening 16 based on the shape of the spherical liquid drop, and a step of determining the distance (T1) from the same diametral position to the forward end position of the spherical liquid drop. Subsequently, the ratio (T1/T2) between the thickness T2 of a tape 2 and the distance T1 is determined, and the shape of the ball 6 is evaluated from a predetermined two-element map based on the ratio (T1/T2). |
