| 摘要 |
A method for manufacturing a head stack assembly is provided to minimize defect generated in a slider, and to improve yield by applying a bonding epoxy to the suspension before the suspension is coupled with one end of the actuator. A flexible printed circuit is combined with an actuator(S110). A bonding epoxy is applied to a suspension(S125). The suspension is coupled with one end of the actuator(S120). A slider is tested and selected(S135). The slider is coupled with one end of the suspension(S130).
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