| 摘要 |
An MEMS probe card with elastic multi-layer structure mainly includes a substrate and a plurality of MEMS probe assemblies. The MEMS probe assemblies are disposed on a plurality of testing pads of the substrate, and each of the MEMS probe assemblies includes a plurality of first layer bridge elements, a second layer bridge element and a probe tip. The first and the second layer bridge elements each forms a <img id="CUSTOM-CHARACTER-00001" he="3.13mm" wi="3.13mm" file="US07301355-20071127-P00001.TIF" alt="custom character" img-content="character" img-format="tif"/>-shaped cross-section and has two piers and a beam. The piers of the second layer bridge elements are respectively disposed on the beams of the first layer elements, and the probe tips are disposed on the beams of the second layer bridge elements. According to the stacks formed by the second layer bridge elements disposing on the first layer bridge elements, the probe tips may have more elastic buffer and a better resistance to the compressive strain when probing the bumps or bonding pads on wafers.
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