| 摘要 |
PROBLEM TO BE SOLVED: To provide a packaging method for a light emitting diode which is manufactured by a flow of a package contrary to that of a conventional technology and does not require conventional wire bonding, and to provided a package structure of the light emitting diode.SOLUTION: The package method comprises steps of: (A) providing a transparent substrate with high transparency; (B) providing an optoelectronic semiconductor chip on a surface of the transparent substrate, the optoelectronic semiconductor chip being provided with a light-emitting face and at least two electrodes, wherein a light emitted from the optoelectronic semiconductor chip penetrates through the transparent substrate; (C) forming an insulating layer on the transparent substrate, so as to partially overlay on the at least two electrodes, the optoelectronic semiconductor chip and the transparent substrate; and (D) providing at least two metal soldering pads separately on the at least two electrodes, and electrically connecting the at least two metal soldering pads with the at least two electrodes respectively.SELECTED DRAWING: Figure 2 |
