| 发明名称 |
METHOD OF MAKING AN ADHESIVE PREFORM LID FOR ELECTRONIC DEVICES |
| 摘要 |
<p>A cover according to the invention comprises a cover having a bonding surface defining a closed bonding pattern, and a bonding pattern of adhesive on the bonding surface of the cover, wherein the bonding pattern of adhesive has at least one gap therein, wherein the gap is sufficiently small as to be filled by the adhesive when the adhesive flows.</p> |
| 申请公布号 |
EP1093407(A1) |
申请公布日期 |
2001.04.25 |
| 申请号 |
EP19990928763 |
申请日期 |
1999.06.17 |
| 申请人 |
AMERASIA INTERNATIONAL TECHNOLOGY, INC. |
发明人 |
CHUNG, KEVIN, KWONG-TAI |
| 分类号 |
H05K9/00;B29C65/50;B29C65/52;H01L21/48;H01L21/50;H01L23/04;(IPC1-7):B32B1/00 |
主分类号 |
H05K9/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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