REFLOW SYSTEM AND METHOD OF HEAT TREATMENT FOR SEMICONDUCTOR WAFER USING THE SYSTEM,申请号KR19980012052-传众专利搜索

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发明名称	REFLOW SYSTEM AND METHOD OF HEAT TREATMENT FOR SEMICONDUCTOR WAFER USING THE SYSTEM
摘要
申请公布号	KR100528451(B1)	申请公布日期	2005.11.07
申请号	KR19980012052	申请日期	1998.04.06
申请人	SAMSUNG ELECTRONICS CO., LTD.	发明人	KO, HYEON GUK;LEE, DU HWAN
分类号	H01L21/027	主分类号	H01L21/027
代理机构		代理人
主权项
地址

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