| 发明名称 |
Circuit card assembly and method of manufacturing thereof |
| 摘要 |
A circuit card assembly is provided. The assembly includes a first printed circuit board, at least one electronic component mounted on the first printed circuit board at a predetermined location, a frame coupled to the first printed circuit board, and a heat transfer assembly coupled to the frame. The heat transfer assembly includes a first plate extending over at least a portion of the first printed circuit board, a heat pipe coupled to the first plate, and a thermally conductive member positioned between the at least one electronic component and the heat pipe. The thermally conductive member is selectively mounted at predetermined locations along the first plate based on the predetermined location of the at least one electronic component. |
| 申请公布号 |
US9370090(B2) |
申请公布日期 |
2016.06.14 |
| 申请号 |
US201414500530 |
申请日期 |
2014.09.29 |
| 申请人 |
General Electric Company |
发明人 |
Chauhan Shakti Singh;Connolly Stuart;Shah Binoy Milan;Hoden Brian;Kim Joo Han |
| 分类号 |
H05K7/20;H05K1/02;H05K1/18;H05K3/30;H05K3/36;G06F1/20 |
主分类号 |
H05K7/20 |
| 代理机构 |
|
代理人 |
Joshi Nitin N. |
| 主权项 |
1. A circuit card assembly comprising:
a first printed circuit board; at least one electronic component mounted on said first printed circuit board at a predetermined location; a frame coupled to said first printed circuit board; and a heat transfer assembly coupled to said frame, wherein said heat transfer assembly comprises:
a first plate extending over at least a portion of said first printed circuit board;a heat pipe coupled to said first plate; anda thermally conductive member positioned between said at least one electronic component and said heat pipe, wherein said thermally conductive member is selectively mounted at predetermined locations along said first plate based on the predetermined location of said at least one electronic component. |
| 地址 |
Niskayuna NY US |
