| 发明名称 |
SYSTEMS AND METHODS FOR THERMAL LOCATION OF COOLING HOLES |
| 摘要 |
Systems and methods are disclosed herein for repairing components. A material layer may be deposited on a surface of a component. The material layer may cover a cooling hole. A pulsed heat source may heat the component and the material layer. An infrared camera may take a series of images of the component. A location of the cooling hole may be identified based on thermal properties of the component. A removal tool may remove a portion of the material layer in order to expose the cooling hole. |
| 申请公布号 |
US2016318135(A1) |
申请公布日期 |
2016.11.03 |
| 申请号 |
US201515030326 |
申请日期 |
2015.01.13 |
| 申请人 |
UNITED TECHNOLOGIES CORPORATION |
发明人 |
Raulerson David A.;Smith Kevin D.;Ouyang Zhong;Brasche Lisa J.;Brindley William J.;Potter David N. |
| 分类号 |
B23P6/00;F01D25/12;F01D9/02 |
主分类号 |
B23P6/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of repairing a component comprising:
depositing a material layer on a surface of the component; heating the component using a pulsed heat source; measuring thermal properties of the component; locating a cavity in the component based on the thermal properties; and removing a portion of the material layer to expose the cavity. |
| 地址 |
Hartford CT US |
