发明名称 |
Method for fabricating resin-molded semiconductor device having posts with bumps |
摘要 |
A semiconductor apparatus includes a semiconductor device to be mounted on a circuit board; a plurality of conductive posts electrically connected to the semiconductor device; and a plurality of conductive bumps each provided on an outer end of each of the conductive posts, so that the plurality of conductive bump is soldered onto the circuit board when the semiconductor device is mounted on the circuit board. A distance between a peripheral edge of the semiconductor device and an outer edge of the conductive post is determined to be narrow so that a solderbility or wetting condition of the conductive bumps can be visibly recognized easily.
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申请公布号 |
US2008070348(A1) |
申请公布日期 |
2008.03.20 |
申请号 |
US20070976785 |
申请日期 |
2007.10.29 |
申请人 |
OKI ELECTRIC INDUSTRY CO., LTD. |
发明人 |
OHUCHI SHINJI;SHIRAISHI YASUSHI;TANAKA YASUO |
分类号 |
H01L21/56;H01L23/28;H01L23/12;H01L23/31;H01L23/485;H01L23/498 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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