发明名称 導電パターンの形成方法及び導電パターン基板
摘要 This method for forming an electroconductive pattern is provided with: a lamination step for readying a photosensitive electroconductive film provided with a support film, an electroconductive layer including electroconductive fiber, and a photosensitive resin layer including a photosensitive resin, in the sequence listed, and laminating the electroconductive layer and the photosensitive resin layer so that the electroconductive layer is on a base material in intimate contact; and a patterning step for exposing and developing the photosensitive resin layer on the base material and thereby forming an electroconductive pattern.
申请公布号 JP5940648(B2) 申请公布日期 2016.06.29
申请号 JP20140509171 申请日期 2013.04.02
申请人 日立化成株式会社 发明人 田仲 裕之;山崎 宏;五十嵐 由三;伊藤 豊樹;太田 絵美子
分类号 H01B13/00;H01B5/14;H05K3/02 主分类号 H01B13/00
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