| 摘要 |
PURPOSE:To improve the characteristics, by forming split packages mounted individually for each carrier and giving waveguide connection for the packages, for keeping a good connecting impedance in attaching and detaching a module at a high frequency band. CONSTITUTION:The titled package for MIC comprises an inner package 20 mounting an MIC airtightly and an outer package 30 split into two and holding the inner package 20. Holes 311, 321 of waveguide construction are drilled to one and the other outer packages 31, 32 of the outer package 30 split into two respectively. Further, a dielectric cap 23 is fitted to a high frequency output terminal 2 of the inner package 20 via a metallic sleeve 22 to form a coaxial terminal. Moreover, one coaxial terminal of the inner package 20 is inserted to one coaxial terminal through-hole 313, the other coaxial terminal is inserted to a coaxial terminal through-hole 323 to fix the outer packages 31, 32 incorporatedly with a tightening screw 34. Then, the connecting impedance in attaching and detaching the module at the high frequency band is kept in an excellent value to improve the characteristics. |
