| 摘要 |
PROBLEM TO BE SOLVED: To provide FIPG for electronic apparatus using hardening liquid composition containing organic polymer containing crosslinked silicon group in which it can be hardened in a short period of time while having adhering possible time sufficiently after irradiation of active energy beam, a housing member adhered under application of the FIPG does not show any exposure of seal not required therein when the housing member is held, the housing member can be removed with a slight force, and after re-working, the gasket is used as it is, the housing member can be re-connected and even after re-connection, seal performance such as initial waterproof performance or the like can be maintained.SOLUTION: This invention relates to a liquid gasket for electronic apparatus including (A) organic polymer containing crosslinked silicon group, (B) photobase generating agent, (C) silicon compound with Si-F connection, and (D) compound with photo-radical polymerizable vinyl group.SELECTED DRAWING: None |
