| 摘要 |
PURPOSE:To facilitate connection work when connecting a semiconductor chip with leads. CONSTITUTION:A mark 7 or a deformation section 8 is installed to a connection section between a lead and a semiconductor chip 1. This mark 7 and the deformation section 8 serve as a guide, which distinguishes easily the priority of leads arrayed. It is, therefore, possible to input coordinates data to a wire bonder with ease.
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