发明名称 Pad assembly for electrochemical mechanical processing
摘要 Embodiments of a pad assembly for processing a substrate are provided. The pad assembly includes a processing layer having a working surface adapted to process a substrate, a lower layer coupled to and disposed below the processing layer, and an electrode having an upper surface disposed above the lower layer and below the working surface of the processing layer. The upper surface of the electrode is at least partially exposed to the working surface to provide an electrolyte pathway between the upper surface of the electrode and the working surface.
申请公布号 US7029365(B2) 申请公布日期 2006.04.18
申请号 US20030744904 申请日期 2003.12.23
申请人 APPLIED MATERIALS INC. 发明人 CHANG SHOU-SUNG;TSAI STAN D;OLGADO DONALD J. K.;CHEN LIANG-YUH;DUBOUST ALAIN;WADENSWEILER RALPH M.
分类号 B24D11/02;B23H5/00;B23H5/06;B23H5/08;B23H5/10;B24B37/04;B24B49/16;B24B53/007;B24D13/14;C25C7/04;C25D17/00;C25D17/10;C25F3/00;H01L21/321 主分类号 B24D11/02
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