发明名称 |
POLYARYLENE ETHER RESIN, MANUFACTURING METHOD OF POLYARYLENE ETHER RESIN, CURABLE RESIN MATERIAL, CURED ARTICLE THEREOF, SEMICONDUCTOR ENCAPSULATION MATERIAL, SEMICONDUCTOR DEVICE, PREPREG, PRINT CIRCUIT BOARD, BUILD-UP FILM, BUILD-UP SUBSTRATE, FIBER-REINFORCED COMPOSITE MATERIAL AND FIBER-REINFORCED MOLDED ARTICLE |
摘要 |
PROBLEM TO BE SOLVED: To provide a polyarylene ether resin excellent in various physical properties of heat resistance, pyrolytic property, moisture resistance and solder resistance, flame retardancy and dielectric property, a manufacturing method of the resin, a cured article thereof, a semiconductor encapsulation material, a semiconductor device, a prepreg, a print circuit board, a build-up film, a build-up substrate, a fiber-reinforced composite material and a fiber-reinforced molded article.SOLUTION: There is provided a polyarylene ether resin having a polyarylene ether structure in a molecular structure, where at least one aromatic nuclear thereof has a naphthalene ring structure and at least one aromatic nuclear thereof has two benzoxazine skeletons obtained by reacting the polyarylene ether, an aromatic monohydroxy compound, a diamine compound and formaldehyde.SELECTED DRAWING: None |
申请公布号 |
JP2016121267(A) |
申请公布日期 |
2016.07.07 |
申请号 |
JP20140261947 |
申请日期 |
2014.12.25 |
申请人 |
DIC CORP |
发明人 |
SHIMONO TOMOHIRO;ARITA KAZUO |
分类号 |
C08G14/073;C07D265/12;C07D265/16;C08J5/04;C08J5/18;C08J5/24;C08K3/00;C08L61/34;H01L23/29;H01L23/31;H05K1/03 |
主分类号 |
C08G14/073 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|