A METHOD OF CONSTRUCTING AN ELECTRONIC ASSEMBLY HAVING AN INDIUM THERMAL COUPLE AND AN ELECTRONIC ASSEMBLY HAVING AN INDIUM THERMAL COUPLE

摘要

ACCORDING TO ONE ASPECT OF THE INVENTION A METHOD OF CONSTRUCTING AN ELECTRONIC ASSEMBLY (60) IS PROVIDED. THE ELECTRONIC ASSEMBLY (60) IS CONSTRUCTED FROM A SEMICONDUCTOR PACKAGE (34) INCLUDING A PACKAGE SUBSTRATE (38) AND A SEMICONDUCTOR CHIP (40) MOUNTED TO THE PACKAGE SUBSTRATE (38), A THERMALLY CONDUCTIVE MEMBER, AND A SUBSTANCE INCLUDING INDIUM. THE METHOD COMPRISES SECURING THE THERMALLY CONDUCTIVE MEMBER AND THE SEMICONDUCTOR PACKAGE (34) IN A SELECTED ORIENTATION RELATIVE TO ONE ANOTHER WITH THE THERMALLY CONDUCTIVE MEMBER ON A SIDE OF THE SEMICONDUCTOR CHIP (40) OPPOSING THE PACKAGE SUBSTRATE (38) AND WITH THE SUBSTANCE LOCATED BETWEEN THE SEMICONDUCTOR CHIP (40) AND AT LEAST A PORTION OF THE THERMALLY CONDUCTIVE MEMBER. THE SUBSTANCE IS THERMALLY COUPLED TO THE SEMICONDUCTOR CHIP (40) ON ONE SIDE AND THERMALLY COUPLED TO THE PORTION OF THE THERMALLY CONDUCTIVE MEMBER ON AN OPPOSING SIDE.