| 摘要 |
PURPOSE:To obtain an epoxy resin composition capable of improving moisture-soldering resistance (resistance to the separation at the soldered position caused by the moisture absorbed) and heat shock resistance of a semiconductor apparatus in which a semiconductor chip loaded on a lead frame made of copper alloy is sealed with a resin and to provide the production method for the epoxy resin composition and a semiconductor apparatus sealed by the epoxy resin composition. CONSTITUTION:The filler of this epoxy resin composition has the following features. It is a mixture of amorphous silica powder A with >=1 kind of inorganic powder B having a larger coefficient of linear expansion than the amorphous silica powder. The content ratio of the inorganic powder B in the total filler material is 20-60vol.% in terms of true specific gravity of the components. Spherical amorphous silica powder having a weight average particle diameter of <1mum and specific gravities of 10-30m<2>/g is contained in an amount of 5-20vol.% based on the total filler material in terms of true specific gravity of the components. Further, when the molded article is produced by the compression under a pressure at which the average particle diameter of the filler is maintained, the fraction of the volume of the filler in the molded article is >=78%. |
