发明名称 Integrated passive device substrate
摘要 The specification describes an integrated passive device (IPD) that is formed on a silicon substrate (51) covered with an oxide layer (52). Unwanted accumulated charge at the silicon/oxide interface are rendered immobile by creating trapping centers in the silicon surface. The trapping centers are produced by a polysilicon layer interposed between the silicon substrate and the oxide layer.
申请公布号 EP1835536(A2) 申请公布日期 2007.09.19
申请号 EP20070250982 申请日期 2007.03.09
申请人 SYCHIP INC. 发明人 DEGANI, YINON;FAN, YU;GAO, CHARLEY CHUNLEI;LAU, MAUREEN;SUN, KUNQUAN;SUN, LINGUO
分类号 H01L21/84;H01L21/02;H01L21/70;H01L21/762;H01L23/66;H01L27/01;H01L27/06;H01L27/13 主分类号 H01L21/84
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