| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a circuit constituent for surely joining at least portions of functional pattern layers formed on the surface of each of a plurality of base materials by crimping working without shifting overlap positions and a method for manufacturing the circuit constituent. <P>SOLUTION: A circuit constituent 102 is provided with: a base material 21 containing resin and a functional pattern layer 20 containing a metallic foil fixed through an adhesive layer 22 on the surface of the base material 21. A thermal adhesive layer 31 containing thermosetting resin of a B stage is formed on the functional pattern layer 20. A thermosetting layer 31 containing thermosetting resin of a B stage is formed on the functional pattern layer 20 of the second circuit constituent 102, and the first and second circuit constituents 101 and 102 are overlapped and heated so as to be fixed so that the function pattern layer 10 can be faced to the function pattern layer 20, and climping working is carried out so that portions of the functional pattern layers 10 and 20 can be brought into contact with each other. <P>COPYRIGHT: (C)2008,JPO&INPIT |
