发明名称 High Q factor integrated circuit inductor
摘要 An inductor and a method of forming and the inductor, the method including: (a) providing a semiconductor substrate; (b) forming a dielectric layer on a top surface of the substrate; (c) forming a lower trench in the dielectric layer; (d) forming a resist layer on a top surface of the dielectric layer; (e) forming an upper trench in the resist layer, the upper trench aligned to the lower trench, a bottom of the upper trench open to the lower trench; and (f) completely filling the lower trench at least partially filling the upper trench with a conductor in order to form the inductor. The inductor including a top surface, a bottom surface and sidewalls, a lower portion of said inductor extending a fixed distance into a dielectric layer formed on a semiconductor substrate and an upper portion extending above said dielectric layer; and means to electrically contact said inductor.
申请公布号 US7068138(B2) 申请公布日期 2006.06.27
申请号 US20040768773 申请日期 2004.01.29
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 EDELSTEIN DANIEL C.;ANDRICACOS PANAYOTIS C.;COTTE JOHN M.;DELIGIANNI HARIKLIA;MAGERLEIN JOHN H.;PETRARCA KEVIN S.;STEIN KENNETH J.;VOLANT RICHARD P.
分类号 H01F27/24;H01F41/04;H01F17/00;H01L21/02;H01L23/485;H01L23/522;H01L23/532;H01L27/08 主分类号 H01F27/24
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