| 摘要 |
<P>PROBLEM TO BE SOLVED: To alleviate temperature rise in a housing and facilitate repair at occurrence of a failure. <P>SOLUTION: The device has support parts 12A, 12B having a slit 13 arranged at the both ends of the housing 10, and a substrate structure A is inserted and supported in the slits 13, 13 of these support parts so that a space part may be formed respectively between these. The substrate structure A is mounted with a plurality of light-emitting diodes 2 on a substrate 1 having a conductive land 5a, terminal parts 4A, 4B so that the respective reeds 3a, 3b may be connected to the respective conductive land electrically and mechanically. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
