发明名称 WIRING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a wiring substrate which is excellent in migration resistance. SOLUTION: This wiring substrate 10 is configured of: a plane-shaped insulating substrate 11; a first circuit 12 and a second circuit 13 arranged on one face 11a; an insulating material 15 arranged so that at least the first circuit 12 can be covered; and a junction 14 in which an end section 13a of the second circuit 13 is overlaid on an end section 12a of the first circuit 12. The migration resistance of the second circuit 13 containing conductive particles is made more excellent than that of the first circuit 12. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008098508(A) 申请公布日期 2008.04.24
申请号 JP20060280311 申请日期 2006.10.13
申请人 FUJIKURA LTD 发明人 HIRATA SHUZO
分类号 H05K1/09;H05K1/11 主分类号 H05K1/09
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