HEAT CONDUCTION SUBSTRATE, MANUFACTURING METHOD THEREOF AND CIRCUIT MODULE

摘要

PROBLEM TO BE SOLVED: To provide a heat conduction substrate hardly influenced by noise by means of mounting a signal circuit using general electronic components and a power circuit using power electronic components requiring heat radiation on the same substrate in a state where they are adjacent to each other. SOLUTION: The heat conduction substrate hardly influenced by a noise and having the high degree of freedom in design is formed in such a way that lead frames 12 and a printed wiring board 10 are formed on substantially the same plane on a metal plate 14 via a heat transfer layer 13, and the power electronic components requiring heat radiation are mounted on the lead frame 12 side and signal system electronic components 17 requiring high-density mounting are mounted on the printed wiring board 10 side, so that the electronic components can be mounted adjacently to each other. A manufacturing method thereof and a circuit module are also provided. COPYRIGHT: (C)2008,JPO&INPIT