发明名称 APPARATUS AND METHOD FOR INSPECTING PRINTED BOARD
摘要 PROBLEM TO BE SOLVED: To provide an apparatus and a method for inspecting a printed board that are capable of easily and inexpensively performing electrical testing of a printed board the position of which should be determined in such a state that a plurality of inspection probes are made close to each other. SOLUTION: An inspection apparatus 10 for performing electrical testing of a printed board 11 comprises: a holding device 18 for holding the printed board 11; moving devices 13, 14, 15 and 16 for moving inspection probes 21a, 21b, 21c, and 21d respectively; and a CCD camera 22 for taking images of tip parts of the inspection probes 21a etc. in such a state that the tip parts of the inspecting probes 21a etc. are positioned within an imaging-enabled area A. Then, position errors between predetermined positions a-d in the imaging-enabled area and the tip parts of the inspection probes 21a etc. are detected from the images taken by the CCD camera, and position correction values of the inspection probes 21a etc. are calculated based on the position errors. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008309601(A) 申请公布日期 2008.12.25
申请号 JP20070157064 申请日期 2007.06.14
申请人 YAMAHA FINE TECHNOLOGIES CO LTD 发明人 ISHII TORU;SASAMINE KEIICHIRO;SAITO TOMOKAZU;TSUCHIDA KENGO
分类号 G01R31/02;G01R31/28;H05K3/00 主分类号 G01R31/02
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