发明名称 LED MODULE
摘要 An LED module includes a mount board and an LED chip. The mount board includes: an insulation substrate that includes resin and glass; a first conductor, a second conductor and a third conductor; and a white resist layer. The white resist layer is provided with a first opening, a second opening and at least one third opening for exposing the first conductor, the second conductor and the third conductor, respectively. The LED module further includes a wavelength conversion layer disposed between the LED chip and the third conductor in a thickness direction of the LED chip. The wavelength conversion layer includes phosphor particles that are excited by first light emitted from the LED chip to emit second light having wavelengths greater than wavelengths of the first light.
申请公布号 US2016260871(A1) 申请公布日期 2016.09.08
申请号 US201615013457 申请日期 2016.02.02
申请人 Panasonic Intellectual Property Management Co., Ltd. 发明人 TAKEHARA Kosuke;FUJITANI Hisaki;TAGAMI Naoki
分类号 H01L33/50;H01L33/56;H01L33/62 主分类号 H01L33/50
代理机构 代理人
主权项 1. An LED module comprising: a mount board including an insulation substrate that includes resin and glass,a first conductor, a second conductor and a third conductor that are on a surface of the insulation substrate, anda white resist layer that covers the first conductor, the second conductor and the third conductor; and an LED chip mounted on the mount board, the white resist layer being provided with a first opening, a second opening and at least one third opening for exposing the first conductor, the second conductor and the third conductor, respectively, the LED chip being provided with a first electrode and a second electrode, which are disposed on a side of one surface in a thickness direction, of the LED chip, the LED chip being disposed to cover the at least one third opening in planar view, the first electrode being electrically connected with the first conductor via a first wire, and the second electrode being electrically connected with the second conductor via a second wire, the LED module further comprising a wavelength conversion layer disposed between the LED chip and the third conductor in the thickness direction of the LED chip, and the wavelength conversion layer including phosphor particles that are excited by first light emitted from the LED chip to emit second light having wavelengths greater than wavelengths of the first light.
地址 Osaka JP