METHODS OF ETCHING GLASS SUBSTRATES AND GLASS SUBSTRATES

摘要

A method of forming a glass substrate includes providing a glass substrate having alumina, translating a pulsed laser beam on the glass substrate to form one or more pilot holes, contacting the glass substrate with an etching solution, and providing agitation. The etching solution has a pH from about 0 to about 2.0, and an etch rate is less than about 3 μm/min. A glass substrate is disclosed having a first surface and a second surface opposite the first surface in a thickness direction, and at least one hole penetrating the first surface, wherein the at least one hole has been etched by an etching solution. A greatest distance d1 between (1) a first plane that contacts the first surface in regions that do not have the at least one hole or a deviation in a thickness of the substrate surrounding the at least one hole and (2) a surface of the deviation recessed from the first plane is less than or equal to about 0.2 μm.

主权项

1. A method of forming a glass substrate with at least one through-feature, comprising:
translating a pulsed laser beam on the glass substrate to form one or more pilot holes, wherein the glass substrate comprises alumina; contacting the glass substrate with an etching solution; and agitating either one of the glass substrate or the etching solution or both during the contacting of the glass substrate and the etching solution to enlarge a diameter of the one or more pilot holes to form the at least one through-feature, wherein: the etching solution has a pH from about 0 to about 2.0, and an etch rate is less than about 3 μm/min.