Conductor for bonding in semiconductor chip - has perforated end section through conducting layer for connection to contact bumps on semiconductor chip

摘要

The conductor is part of a film contact tape (4) which is fixed to a carrier (10). The film contact tape comprises a carrier tape and a number of conductors (1) which have a perforated end portion. A contact stage (13) carrier the semiconductor chip (2) on which contact bumps (3) are formed. A rotary mechanism (13a) is used to turn the contact bumps, and a vertical setting mechanism (14) brings the bumps and the perforated section into contact, such that a force exists which deforms the conductor (1) so that the ends of the conductors press onto the contact bumps. Meanwhile, the semiconductor chip is heated and the fused bumps penetrate into the perforations to form electrical contacts. ADVANTAGE - Prevents bonding of conductor causing reduction in connection strength. Does not use press head.