发明名称 MEMS structure using carbon dioxide and method of fabrication
摘要 A MEMS device is encapsulated in a carbon dioxide environment, which effectively insulates the MEMS device against arcing in high voltage applications. The carbon dioxide environment may have a pressure of between about 0.2 atm and about 4 atm. Carbon dioxide is shown to be more effective than other insulating gases such as sulfur hexafluoride in preventing arcing for applications having dimensions on the order of microns.
申请公布号 US2008169521(A1) 申请公布日期 2008.07.17
申请号 US20070652631 申请日期 2007.01.12
申请人 INNOVATIVE MICRO TECHONOLOGY 发明人 FOSTER JOHN S.;PARANJPYE ALOK;SUMMERS JEFFERY F.;THOMPSON DOUGLAS L.
分类号 H01L29/84;H01L21/56;H01L21/67 主分类号 H01L29/84
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