| 摘要 |
<p>PURPOSE: A semiconductor package is provided to minimize package defects caused by a defective contact between lead frames, by adhering the lead frames by a spot welding using a laser or high voltage after aligning the lead frames. CONSTITUTION: A semiconductor package comprises the first lead frame, the second lead frame, a semiconductor chip(400), a wire and a molding resin. The first lead frame further comprises a conductive strip body, inner leads(120) and outer leads(130). The inner leads are established inside a plurality of molding regions formed in the strip body. The outer leads are formed outside the molding region. The second lead frame further comprises a conductive strip body, inner leads(220) and connection leads(230). The inner leads are established inside a plurality of molding regions formed in the strip body. The connection leads are formed inside the molding region and connected to the outer lead by thermal resistance generated by a thermal resistance generating unit. The semiconductor chip is adhered to the inner lead of the first and second lead frames while being insulated. The wire electrically connects the inner lead with the semiconductor chip. The molding resin encapsulates the first and second lead frames, the semiconductor chip and the wire.</p> |
