| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a package for accommodating an electronic component which surely prevents the electronic component accommodated in a vessel from being affected by electromagnetic waves and can normally and stably operate the electronic component for a long term. SOLUTION: This package for accommodating an electronic component is constituted of an insulating substrate 1 and a conductive lid 2. In the insulating substrate 1, a mounting part 1a where an electronic component 3 is mounted on the upper surface, and a frame-shaped metal layer which is formed surrounding the mounting part 1a are installed, and a metal layer 8 electrically connected with the frame-shaped metal layer is arranged below the mounting part 1a. The conductive lid 2 is bonded to the frame-shaped metal layer via a conductive sealing member 10. The electronic component 3 is airtightly accommodated in a vessel 4 constituted of the insulating substrate 1 and the conductive lid 2, electrically connecting the metal layer 8 and the conductive lid 2. A large number of penetrating holes are formed in the frame-shaped metal layer.</p> |
