| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a holding table mechanism of a polishing device which solidly holds a wafer even in a state where pressing force is small, and prevents the occurrence of sagging in a wafer outer peripheral part. <P>SOLUTION: This holding table mechanism of the polishing device includes: a rotationally driven holding table base 50; a holding table 56 connected onto the holding table base through a universal joint 54, and having a plurality of branch paths and openings formed on a support surface; a holding pad 66 arranged on the holding table, having a plurality of pores, and holding a wafer; an annular member 64 arranged on the holding table through an elastic member 62 to define a predetermined annular space between the outer periphery of the holding pad and itself, and polished by a polishing pad along with the wafer; a first fluid passage 72 connected to a suction source; and a second fluid passage 74 selectively connected to a water feed source and the suction source discharging drain. The wafer is sucked by the suction source and solidly held thereto. Sagging of the outer peripheral part of the wafer is prevented by simultaneously polishing the annular member along with the wafer. <P>COPYRIGHT: (C)2010,JPO&INPIT |
