发明名称 Process for fabricating ULSI CMOS circuits using a single polysilicon gate layer and disposable spacers
摘要 This invention is a process for fabricating ultra-large-scale integration CMOS circuits using a single polysilicon gate layer for both N-channel and P-channel devices, a single mask step for defining the gates of both N-channel and P-channel devices, the fabrication of one set of disposable spacers for N-channel implants, and the fabrication of another set of disposable spacers for P-channel source/drain implants. The set of spacers used for P-channel implants also comprises material deposited to fabricate the spacers for the N-channel implants. The process is adaptable to LDD structures for both N-channel and P-channel devices or for only N-channel devices. The process is also compatible with anti-punchthrough implants for both types of devices.
申请公布号 US5405791(A) 申请公布日期 1995.04.11
申请号 US19940317280 申请日期 1994.10.04
申请人 MICRON SEMICONDUCTOR, INC. 发明人 AHMAD, AFTAB;LOWREY, TYLER A.
分类号 H01L21/8238;(IPC1-7):H01L21/336;H01L21/823 主分类号 H01L21/8238
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