发明名称 METHOD FOR FORMING CLOSED STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a method for forming a tightly closed structure reducing air bubbles generated in an adhesive. SOLUTION: This method is to form the tightly closed structure 100 having a tightly sealed inner space 30 and comprises a process for applying an adhesive 50 to a groove 21 of a lower case 20 in a pair of upper case 10 and a lower case 20 forming the inner space 30, a process for facing a protruded end 11 of the upper case 10 to the groove 21 through the adhesive 50 before curing the adhesive 50 and combining the upper case 10 to the lower case 20 by pressing in the direction of contraction of the initially formed inner space 30, and a process for curing the adhesive 50 in the assembled state. In the applying process, a gap 51 which is a non-coated region is formed in a part of the groove 21 to tightly seal the inner space 30 by flow of the adhesive 50 before curing the adhesive 50 by discharging a gas compressed during the assembly in the inner space 30. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005232420(A) 申请公布日期 2005.09.02
申请号 JP20040046829 申请日期 2004.02.23
申请人 DENSO CORP 发明人 TOIDA TAKASHI
分类号 H05K5/06;C09J5/00;C09J201/00;(IPC1-7):C09J5/00 主分类号 H05K5/06
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