ALUMINUM BASED BONDING OF SEMICONDUCTOR WAFERS

摘要

Aluminum or aluminum alloy on each of a pair of semiconductor wafers is thermocompression bonded. Aluminum-based seal rings or electrical interconnects between layers may be thus formed. On a MEMS device, the aluminum-based seal ring surrounds an area occupied by a movably attached microelectromechanical structure. According to a manufacturing method, wafers have an aluminum or aluminum alloy deposited thereon are etched to form an array of aluminum-based rings. The wafers are placed so as to bring the arrays of aluminum-based rings into alignment. Heat and compression bonds the rings. The wafers are singulated to separate out the individual semiconductor devices each with a bonded aluminum-based ring.