发明名称 HIGH DENSITY 3-D INTEGRATED CIRCUIT PACKAGE
摘要 A slotted file is created by connecting two side walls and a back wall. The side walls have etched grooves facing directly across from each other. The platelet has flanges that fit into the grooves. In one embodiment, a completed cube is formed when the platelets fill the slotted file.
申请公布号 EP1468594(A2) 申请公布日期 2004.10.20
申请号 EP20030728218 申请日期 2003.01.22
申请人 HONEYWELL INTERNATIONAL INC. 发明人 SULLIVAN, GERARD, J.;HUGHES, A., JAMES;ADKINS, LARRY, R.;RAU, JAMES, R.
分类号 H01L25/18;H01L23/02;H01L23/06;H01L23/48;H01L25/04;H01L25/065;H01L25/07;H01L25/10;H05K1/14;H05K7/02;(IPC1-7):H05K7/02 主分类号 H01L25/18
代理机构 代理人
主权项
地址