| 摘要 |
Provided is a semiconductor device in which the size of a withstand voltage structure part can be easily reduced. Provided is a semiconductor device provided with a withstand voltage structure part and an active region formed on the obverse surface side of a semiconductor substrate, the withstand voltage structure part being provided with: a guard ring provided on the obverse surface side of the semiconductor substrate so as to surround the active region; a first field plate provided on the obverse surface side of the guard ring; an electrode part provided on the obverse surface side of the first field plate; a second field plate provided between the first field plate and the electrode part; and a conducting connection part for electrically connecting the first field plate, the electrode part, the second field plate, and the guard ring to each other. |
