发明名称 |
Housing for a photoactive semiconductor chip and a method for the production thereof |
摘要 |
In a process for producing a ceramic housing ( 1 ), first of all a ceramic base body ( 4 ) comprising a ceramic base ( 2 ) and side parts ( 3 ) is produced. Then, a metal frame ( 7 ) is placed onto the ceramic base body ( 4 ) and a window ( 11 ) is soldered onto a side opening ( 6 ). After a photoactive semiconductor chip has been introduced into the ceramic base body ( 4 ), the ceramic housing ( 1 ) is closed off using a metal cover ( 12 ).
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申请公布号 |
US7115962(B2) |
申请公布日期 |
2006.10.03 |
申请号 |
US20040479008 |
申请日期 |
2004.05.07 |
申请人 |
OSRAM OPTO SEMICONDUCTORS GMBH |
发明人 |
GROETSCH STEFAN |
分类号 |
H01L23/08;H01L31/0203;H01L21/00;H01L23/00;H01L23/02;H01L23/04;H01L23/053;H01L23/12;H01L25/16;H01L27/146;H01L31/02;H01L31/0232;H01L33/48;H01S5/022 |
主分类号 |
H01L23/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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