发明名称 |
Substrate for use in semiconductor manufacturing and method of making same |
摘要 |
A lead-frame based substrate panel for use in semiconductor packaging is described. The substrate panel includes a lead-frame panel having at least one array of device areas. Each device area has a plurality of contacts. The lead-frame panel is filled with a dielectric material to form a relatively rigid substrate panel that can be used for packaging integrated circuits. The top surface of the dielectric material is typically substantially coplanar with the top surface of the lead-frame panel, and the bottom surface of the dielectric material is typically substantially coplanar with the bottom surface of the lead-frame panel.
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申请公布号 |
US7102209(B1) |
申请公布日期 |
2006.09.05 |
申请号 |
US20030650325 |
申请日期 |
2003.08.27 |
申请人 |
NATIONAL SEMICONDUCTOR CORPORATION |
发明人 |
BAYAN JAIME;PRABHU ASHOK S.;DRUMMOND FRED |
分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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