| 摘要 |
PURPOSE:To bond a wire with bonding surfaces in various directions by one bonding tool, and to improve productivity by rotatably setting up a work holder holding a semiconductor while turning the holder by a driving means. CONSTITUTION:The axis of a capillary 5 executing the wire bonding of a semiconductor device 2B can be moved vertically and bilaterally while it is directed in the vertical direction. The work holder 12 holding the device 2B is turned by a motor such as a pulse motor not shown and a cam and the like. The turn and rocking of the holder 12 are controlled by a control section so that the bonding surfaces 8a, 10a of one semiconductor chip 8 and an external lead electrode 10 and the axis of the capillary 5 or the bonding surfaces 9a, 11a of the other semiconductor chip 9 and an external lead electrode 11 and the axis of the capillary 5 are each crossed at right angles. The wire is bonded with the bonding surfaces in various directions by one bonding tool, and productivity is improved. |
