摘要 |
<P>PROBLEM TO BE SOLVED: To provide a surface-mounted LED using an electronic component mounting substrate with a structure in which a frame is installed on a holding plate having one electrode and the other electrode respectively used also for a support plate and composed of a metal body, holding both electrodes after arranging them side by side via a prescribed interval, and also having a central hole and right and left holes. <P>SOLUTION: The electronic component mounting substrate is formed by using the following structure. The previously formed frame is mounted on the holding plate having the two electrodes respectively used also for the support plate and composed of the metal body and holding both electrodes after arranging them side by side via a prescribed interval, and to which a hole for mounting an LED and holes for connection are formed. An LED element is mounted to the electrode in the hole for mounting an LED. The electrode of the LED element and the two electrodes respectively used also for the support plate under the holes for connection and composed of the metal body are connected with each other by a metal thin wire. The LED element and the metal thin wire are sealed with a translucent resin. <P>COPYRIGHT: (C)2007,JPO&INPIT |