Laminate, conductive pattern, electrical circuit, and method for producing laminate

摘要

The present invention provides a laminate in which at least a layer including a support, a primer layer, a first conductive layer, an insulating layer, and a second conductive layer are laminated, wherein the insulating layer is formed by coating at least a portion of or entirety of a surface of the first conductive layer with a resin composition and drying the resin composition; and the second conductive layer includes a second plating seed layer formed by coating a portion of or entirety of a surface of the insulating layer with a fluid containing a conductive substance, and a second plating layer formed on a surface of the second plating seed layer. This laminate has high adhesion between layers and allows the high adhesion to be maintained even upon exposure to a high-temperature and high-humidity environment.

主权项

1. A laminate in which at least a layer (A) including a support, a primer layer (B), a first conductive layer (C), an insulating layer (D), and a second conductive layer (E) are laminated, wherein the insulating layer (D) is formed by coating at least a portion of or entirety of a surface of the first conductive layer (C) with a resin composition (d) and drying the resin composition (d); the first conductive layer (C) includes a first plating seed layer (C-1) formed by coating a portion of or entirety of a surface of the primer layer (B) with a fluid (c-1) containing a conductive substance that is a transition metal or a compound of a transition metal, and a first plating layer (C-2) formed on a surface of the first plating seed layer (C-1); and the second conductive layer (E) includes a second plating seed layer (E-1) formed by coating a portion of or entirety of a surface of the insulating layer (D) with a fluid (e-1) containing a conductive substance that is a transition metal or a compound of a transition metal, and a second plating layer (E-2) formed on a surface of the second plating seed layer (E-1).