| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC chip jointing method for improving jointing reliability in a pressure welding method using a conductive adhesive.SOLUTION: An IC chip jointing method for heating and pressurizing an IC chip against a substrate and jointing the IC chip with an anisotropic conductive adhesive of thermosetting type, includes a mounting step of mounting the IC chip onto the substrate to which the conductive adhesive is applied, a heating/pressurizing step of sandwiching the IC chip mounted on the substrate and the substrate vertically between an upper head and a lower head and pressurizing the IC chip and the substrate and then heating the applied conductive adhesive, and an oscillation step of oscillating the IC chip vertically and horizontally with a low frequency of 2000 Hz or lower with respect to the substrate during the heating/pressurizing step.SELECTED DRAWING: Figure 3 |
