发明名称 Self-aligned silicide manufacturing method
摘要 An improved self-aligned silicide manufacturing method in which prior to the formation of a heat resistant metallic layer on top of a silicon substrate, a treatment of exposed surfaces of a gate terminal and source/drain diffusion regions is performed to increase surface roughness enabling an increase in crystallization nucleus number, as well as lowering crystallization temperature.
申请公布号 US5893751(A) 申请公布日期 1999.04.13
申请号 US19960736939 申请日期 1996.10.25
申请人 UNITED MICROELECTRONICS CORPORATION 发明人 JENQ, JASON;CHEN, TUNG-PO
分类号 H01L21/285;(IPC1-7):H01L21/44 主分类号 H01L21/285
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