PROBE SYSTEM FOR TESTING CHIP DE-CAPPED

摘要

A probe system for testing a de-capped semiconductor chip is provided to simultaneously test or analyze both sides of a chip pad without reversing the de-capped semiconductor chip, which is a testing target. An upper camera(100) is installed vertically to the upper part of a base plate. A transfer unit(40) transfers the upper camera in vertical and horizontal directions. A chip loading unit is installed at the base plate under the upper camera. A pair of upper positioners(50) are installed on the upper surface of the base plate. A lower plate(32) is installed at the lower part of the base plate and is elevated by an elevating unit. A lower positioner is installed on the upper surface of the lower plate. A lower camera(200) is installed vertically to the lower part of the chip loading unit. A clamper is installed at the chip loading unit in order to clamp a de-capped chip.