发明名称 Method for manufacturing capacitor of semiconductor element
摘要 A method for manufacturing a capacitor of a semiconductor element including: forming a bottom electrode of the capacitor on a semiconductor substrate; performing rapid thermal nitrification (RTN) on the upper surface of the bottom electrode; performing a thermal process on the obtained structure having the bottom electrode in a furnace under a nitride atmosphere to eliminate stress generated by the RTN; forming Al<SUB>2</SUB>O<SUB>3 </SUB>and HfO<SUB>2 </SUB>dielectric films on the nitrified bottom electrode; and forming a plate electrode of the capacitor on the Al<SUB>2</SUB>O<SUB>3 </SUB>and HfO<SUB>2 </SUB>dielectric films. The thermal process is performed after the RTN performed on the surface of the bottom electrode, so that stress, generated from the RTN, is alleviated, thereby allowing the capacitor to obtain a high capacitance and lowering leakage current.
申请公布号 US7300852(B2) 申请公布日期 2007.11.27
申请号 US20050089122 申请日期 2005.03.24
申请人 HYNIX SEMICONDUCTOR INC. 发明人 CHO HO JIN;CHANG JUN SOO;LEE EUN A.;CHAE SU JIN;KIM YOUNG DAE
分类号 H01L21/20 主分类号 H01L21/20
代理机构 代理人
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